Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems SCIE

國(guó)際簡(jiǎn)稱(chēng)：IEEE T COMPUT AID D 參考譯名：集成電路和系統(tǒng)的計(jì)算機(jī)輔助設(shè)計(jì)IEEE Transactions

主要研究方向：工程技術(shù)-工程：電子與電氣非預(yù)警期刊審稿周期：一般,3-8周

《集成電路和系統(tǒng)的計(jì)算機(jī)輔助設(shè)計(jì)IEEE Transactions》(Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技術(shù)-工程：電子與電氣為研究特色的國(guó)際期刊，發(fā)表該領(lǐng)域相關(guān)的原創(chuàng)研究文章、評(píng)論文章和綜述文章，及時(shí)報(bào)道該領(lǐng)域相關(guān)理論、實(shí)踐和應(yīng)用學(xué)科的最新發(fā)現(xiàn)，旨在促進(jìn)該學(xué)科領(lǐng)域科學(xué)信息的快速交流。該期刊是一本未開(kāi)放期刊，近三年沒(méi)有被列入預(yù)警名單。

3區(qū) 中科院分區(qū)
Q2 JCR分區(qū)
413 年發(fā)文量
2.7 IF影響因子
未開(kāi)放 是否OA
107 H-index
1982 創(chuàng)刊年份
Monthly 出版周期
English 出版語(yǔ)言

The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.

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Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems期刊信息

ISSN：0278-0070
出版語(yǔ)言：English
是否OA：未開(kāi)放
E-ISSN：1937-4151
出版地區(qū)：UNITED STATES
是否預(yù)警：否
出版商：Institute of Electrical and Electronics Engineers Inc.
出版周期：Monthly
創(chuàng)刊時(shí)間：1982
開(kāi)源占比：0.1171
Gold OA文章占比：8.71%
OA被引用占比：0
出版國(guó)人文章占比：0.22
出版撤稿占比：0
研究類(lèi)文章占比：100.00%

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems CiteScore評(píng)價(jià)數(shù)據(jù)（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指數(shù)

5.6

0.957

1.335

學(xué)科類(lèi)別	分區(qū)	排名	百分位
大類(lèi)：Computer Science 小類(lèi)：Computer Graphics and Computer-Aided Design	Q1	26 / 106	75%
大類(lèi)：Computer Science 小類(lèi)：Electrical and Electronic Engineering	Q2	228 / 797	71%
大類(lèi)：Computer Science 小類(lèi)：Software	Q2	155 / 407	62%

名詞解釋?zhuān)?/b>CiteScore 是衡量期刊所發(fā)表文獻(xiàn)的平均受引用次數(shù)，是在 Scopus 中衡量期刊影響力的另一個(gè)指標(biāo)。當(dāng)年CiteScore 的計(jì)算依據(jù)是期刊最近4年（含計(jì)算年度）的被引次數(shù)除以該期刊近四年發(fā)表的文獻(xiàn)數(shù)。例如，2022年的 CiteScore 計(jì)算方法為：2022年的 CiteScore =2019-2022年收到的對(duì)2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻(xiàn)數(shù)量注：文獻(xiàn)類(lèi)型包括：文章、評(píng)論、會(huì)議論文、書(shū)籍章節(jié)和數(shù)據(jù)論文。

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems中科院評(píng)價(jià)數(shù)據(jù)

中科院 2023年12月升級(jí)版

Top期刊綜述期刊大類(lèi)學(xué)科小類(lèi)學(xué)科

否否計(jì)算機(jī)科學(xué) 3區(qū) COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 3區(qū) 3區(qū) 3區(qū)

中科院 2022年12月升級(jí)版

Top期刊綜述期刊大類(lèi)學(xué)科小類(lèi)學(xué)科

否否計(jì)算機(jī)科學(xué) 3區(qū) COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 3區(qū) 3區(qū) 3區(qū)

中科院 2021年12月舊的升級(jí)版

Top期刊綜述期刊大類(lèi)學(xué)科小類(lèi)學(xué)科

否否計(jì)算機(jī)科學(xué) 2區(qū) COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 2區(qū) 2區(qū) 3區(qū)

中科院 2021年12月基礎(chǔ)版

Top期刊綜述期刊大類(lèi)學(xué)科小類(lèi)學(xué)科

否否工程技術(shù) 3區(qū) COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 3區(qū) 4區(qū) 4區(qū)

中科院 2021年12月升級(jí)版

Top期刊綜述期刊大類(lèi)學(xué)科小類(lèi)學(xué)科

否否計(jì)算機(jī)科學(xué) 2區(qū) COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 2區(qū) 2區(qū) 3區(qū)

中科院 2020年12月舊的升級(jí)版

Top期刊綜述期刊大類(lèi)學(xué)科小類(lèi)學(xué)科

否否計(jì)算機(jī)科學(xué) 3區(qū) COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 3區(qū) 3區(qū) 3區(qū)

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems JCR評(píng)價(jià)數(shù)據(jù)（2023-2024年最新版）

按JIF指標(biāo)學(xué)科分區(qū) 收錄子集分區(qū) 排名百分位

學(xué)科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 27 / 59

55.1%

學(xué)科：COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q2 76 / 169

55.3%

學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 154 / 352

56.4%

按JCI指標(biāo)學(xué)科分區(qū) 收錄子集分區(qū) 排名百分位

學(xué)科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 28 / 59

53.39%

學(xué)科：COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q2 82 / 169

51.78%

學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 152 / 354

57.2%

Top期刊	綜述期刊	大類(lèi)學(xué)科	小類(lèi)學(xué)科
否	否	計(jì)算機(jī)科學(xué)	3區(qū)	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	3區(qū) 3區(qū) 3區(qū)

Top期刊	綜述期刊	大類(lèi)學(xué)科	小類(lèi)學(xué)科
否	否	計(jì)算機(jī)科學(xué)	3區(qū)	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	3區(qū) 3區(qū) 3區(qū)

Top期刊	綜述期刊	大類(lèi)學(xué)科	小類(lèi)學(xué)科
否	否	計(jì)算機(jī)科學(xué)	2區(qū)	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用	2區(qū) 2區(qū) 3區(qū)

Top期刊	綜述期刊	大類(lèi)學(xué)科	小類(lèi)學(xué)科
否	否	工程技術(shù)	3區(qū)	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	3區(qū) 4區(qū) 4區(qū)

Top期刊	綜述期刊	大類(lèi)學(xué)科	小類(lèi)學(xué)科
否	否	計(jì)算機(jī)科學(xué)	2區(qū)	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用	2區(qū) 2區(qū) 3區(qū)

Top期刊	綜述期刊	大類(lèi)學(xué)科	小類(lèi)學(xué)科
否	否	計(jì)算機(jī)科學(xué)	3區(qū)	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī)：硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 計(jì)算機(jī)：跨學(xué)科應(yīng)用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	3區(qū) 3區(qū) 3區(qū)

按JIF指標(biāo)學(xué)科分區(qū)	收錄子集	分區(qū)	排名	百分位
學(xué)科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE	SCIE	Q2	27 / 59	55.1%
學(xué)科：COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS	SCIE	Q2	76 / 169	55.3%
學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	154 / 352	56.4%

按JCI指標(biāo)學(xué)科分區(qū)	收錄子集	分區(qū)	排名	百分位
學(xué)科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE	SCIE	Q2	28 / 59	53.39%
學(xué)科：COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS	SCIE	Q2	82 / 169	51.78%
學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	152 / 354	57.2%

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems歷年數(shù)據(jù)統(tǒng)計(jì)

影響因子

中科院分區(qū)

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems中國(guó)學(xué)者發(fā)文選摘

1、Energon: Toward Efficient Acceleration of Transformers Using Dynamic Sparse Attention
Author: Zhou, Zhe; Liu, Junlin; Gu, Zhenyu; Sun, Guangyu

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 136-149. DOI: 10.1109/TCAD.2022.3170848

2、A Low-Latency and High-Endurance MLC STT-MRAM-Based Cache System
Author: Zhao, Wei; Xu, Jie; Wei, Xueliang; Wu, Bing; Wang, Chengning; Zhu, Weilin; Tong, Wei; Feng, Dan; Liu, Jingning

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 122-135. DOI: 10.1109/TCAD.2022.3169458

3、McPAT-Calib: A RISC-V BOOM Microarchitecture Power Modeling Framework
Author: Zhai, Jianwang; Bai, Chen; Zhu, Binwu; Cai, Yici; Zhou, Qiang; Yu, Bei

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 243-256. DOI: 10.1109/TCAD.2022.3169464

4、Efficient Proximity Effect Correction Using Fast Multipole Method With Unequally Spaced Grid for Electron Beam Lithography
Author: Yao, Wenze; Zhao, Haojie; Hou, Chengyang; Liu, Wei; Xu, Hongcheng; Zhang, Xin; Xiao, Jing; Liu, Jie

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 218-228. DOI: 10.1109/TCAD.2022.3171441

5、PASGCN: An ReRAM-Based PIM Design for GCN With Adaptively Sparsified Graphs
Author: Yang, Tao; Li, Dongyue; Ma, Fei; Song, Zhuoran; Zhao, Yilong; Zhang, Jiaxi; Liu, Fangxin; Jiang, Li

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 150-163. DOI: 10.1109/TCAD.2022.3175031

6、SDP: Co-Designing Algorithm, Dataflow, and Architecture for In-SRAM Sparse NN Acceleration
Author: Tu, Fengbin; Wang, Yiqi; Liang, Ling; Ding, Yufei; Liu, Leibo; Wei, Shaojun; Yin, Shouyi; Xie, Yuan

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 109-121. DOI: 10.1109/TCAD.2022.3172600

7、SoBS-X: Squeeze-Out Bit Sparsity for ReRAM-Crossbar-Based Neural Network Accelerator
Author: Liu, Fangxin; Wang, Zongwu; Chen, Yongbiao; He, Zhezhi; Yang, Tao; Liang, Xiaoyao; Jiang, Li

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 204-217. DOI: 10.1109/TCAD.2022.3172907

8、Design Automation for Continuous-Flow Lab-on-a-Chip Systems: A One-Pass Paradigm
Author: Huang, Xing; Pan, Youlin; Chen, Zhen; Guo, Wenzhong; Wang, Lu; Li, Qingshan; Wille, Robert; Ho, Tsung-Yi; Schlichtmann, Ulf

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2023; Vol. 42, Issue 1, pp. 327-331. DOI: 10.1109/TCAD.2022.3166105

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